SEMICONDUCTOR

Mainly used in the field of integrated circuit packaging, including wafer-level package (WLP), panel-level package (PLP), flip-chip ball grid array (FCBGA), flip-chip chip scale package (FCCSP) and system-in-package (SiP), etc. Including processes such as Underfill, Dam & Fill, Flux Spray, Solder Paste Painting and Lid Attach.

SEMICONDUCTOR

Mainly used in the field of discrete component packaging, including Leadframe Package, Substrate Package and Shell & Case Package, etc. Including processes such as Chip Coating, Solder Paste Painting, Potting, ComponentReinforced-Gluing and Underfill.

PRECISION ELECTRONICS

Mainly used in the field of consumer precision electronics, including processes such as dust-catching gluing, prism gluing, Holder Bond, Lens shading gluing, enameled wire welding for VCM and solder joint protection gluing in the CCM field, Tuffy gluing in the screen display field, MiniLED Chip Coating, Underfill in the SMT field, Component Coating, 3D mobile phone middle bezel dispensing in the FATP field and VR/AR middle bezel dispensing

PRECISION ELECTRONICS

Mainly used in the field of intelligent automotive electronics, including processes such as structural bonding, component sealing, local reinforcement, coating protection and thermal glue coating of relevant products in the field of intelligent cockpits, ADASs, electric drives, electric controls, vehicle-mounted FPCs and automotive lamps, etc.