Mainly used in the field of integrated circuit packaging, including wafer level package (WLP), flip-chip ball grid array (FCBGA), flip-chip chip scale package (FCCSP) and system-in-package (SiP), etc. Including processes such as Underfill, Dam & Fill, Flux Spray, Solder Paste Painting and Lid Attach.

Mainly used in the field of discrete device packaging, including Leadframe Package, Substrate Package and Shell & Case Package, etc. Including processes such as Chip Coating, Solder Paste Painting, Potting, Component Reinforced-Gluing and Underfill.

Mainly used in the field of consumer precision electronics. Including processes such as dust-catching gluing, prism gluing, Holder Bonding, Lens shading gluing, VCM enameled wire welding and solder joint protection gluing in the CCM field, Tuffy gluing in the screen display field, MiniLED Chip Coating, Underfill in the SMT field, Component Coating, 3D mobile phone middle bezel dispensing in the FATP field and VR/AR middle bezel dispensing.

Mainly used in the field of intelligent automotive electronics. Including processes such as structural bonding, component sealing, thermal gel and device potting of relevant products in the field of three electrics (battery, electric drive and electric control), intelligent cabins and automatic driving of new energy vehicles, etc.