Supporting 8/12-inch wafer dispensing.

In the whole process of wafer turnover and operation, the temperature is finely controlled and automatically corrected to meet the Underfill process requirements while ensuring the safety of products.

The whole-process video monitoring facilitates product turnover, operation process observation, and problem tracing and analysis.

Dustproof class 100 (Class 100 workshop; Class 10 locally), meeting the environmental requirements of wafer-level packaging.

ESD protection meeting international IEC and ANSI standards.