Features and AdvantagesThe deviation of glue amount caused by the level difference is eliminated, realizing stable dispensing and avoiding poor operation.
The automatic suck-back pressure control can effectively prevent glue dripping and help eliminate bubbles to ensure stable dispensing.
By accurately detecting the remaining glue amount in the syringe and comparing it with the set threshold, you are reminded to replace the syringe in time to avoid poor operation caused by lack of glue.
Application Fields
Technical Specifications| Model | KDC2200 | KDC2500 |
| Dispensing method | Pneumatic pulse type | |
| Main functions | Automatic suck-back to prevent glue dripping, automatic remaining amount warning, and glue amount compensation based on level detection, etc. | |
| Dispensing mode | Timing mode (TIMED) / linkage mode (LINKAGE) | |
| Input air pressure | 0.3-0.4Mpa (Optimum: 0.3MPa, Max.: 0.4MPa) | 0.6-0.7MPa (Optimum: 0.6MPa, Max.: 0.7MPa） |
| Output air pressure | 0.03-0.2MPa | 0.03-0.5MPa |
| Dispensing time | 0.001-999.9s | |
| Vacuum suck-back air pressure | -20-0kPa | |
| Storage channel | 100CH | |
| Operating power input | AC220V/50Hz | |
| Power | 15W | |
| Dimensions (W*D*H) | 260*252*100mm | |
| Weight | 4.5kg | |
| Communication interface | RS232/RS485 | |
| Certification standard | CE certification | |
Process DifficultiesFor such process applications as semiconductor chip packaging and MEMS in which solder paste/silver paste is used to achieve conductive connection, common valves have problems such as low efficiency or high maintenance costs for consumables. Especially, mainstream 5# and 6# solder balls are easily broken by shock and thus block the nozzle.
When a conventional pneumatic dispensing controller is used in the above process applications, its slow output air pressure response and low pressure stability, etc. lead to relatively poor dispensing consistency.
The KDC series controller with high-precision needles can perfectly solve the above problems.
