Supporting 8/12-inch wafer dispensing.

Dustproof level 10, meeting the environmental requirements of wafer level packaging.

ESD protection meeting international IEC and ANSI standards.

In the whole process of wafer turnover and operation, the temperature is finely controlled and automatically corrected to meet the CUF process requirements while ensuring the product safety.

The whole-process video monitoring facilitates product turnover, operation process observation, and problem tracing and analysis